Laser Depaneling of Insulated Metal Substrates (IMS)

LPKF specially developed laser depaneling solutions also allow socalled Insulated Metal Substrates (IMS), i.e. printed circuit boards with a metal core made of aluminium, copper or stainless steel, to be cut and separated from a total panel.

Application of IMS

Insulated Metal Substrates can be found in a variety of applications, which are especially characterized by increased reqirements for heat dissipation. These include among others:

  • Power electronics (e.g. transformers, transistor arrays, motor drivers etc.)
  • Automotive/Transport(e.g. light/LED modules, GPS systems, power modules etc.)
  • Communication (e.g. power amplifier, transmitters, microstrip circuits etc.)
  • Consumer electronics (e.g. motor and voltage regulator, amplifiers, equalizer etc.)
  • and much more

Structure of IMS

Printed circuit boards with a metal core basically consist of three different layers (see figure):

  • Circuit layer:e.g. copper foil
  • Dielectric layer:e.g. of polymer or ceramic
  • Heat conducting layer:e.g. of aluminium, copper or stainless steel

These layers differ significantly in terms of their respective material thickness. The individual heat conducting layers are characterized by varying thermal conductive coefficients, which qualify the materials for different areas of application.

Intelligent Platform to Realize Fully Automated Process Optimization: Smart Factory

Printer Closed Loop (optional)

  • Real time communication of printing process monitoring data with Screen Printers
  • Supports pick-and-place process optimization by controlling panels containing defects
  • Less Human Intervention
  • Live Feedback without Sarcrificing Cycle Time
  • Printing Quality Improvement
  • Yield Improvement

SPC @KSMART (optional)

Reliable 3D Data based Statistical Process Control

  • Carry out essential analyses from an intuitive graphical interface
  • Accelerate root cause analysis for increased equipment uptime

Link @KSMART (optional)

3D data based SPI-AOI communication solution

  • Review, diagnosis and optimization of printing, pick-and-place and reflow process
  • Traces root cause of defects by storing and communicating inspection results from Koh Young’s 3D SPI and 3D AOI System

Real-Time Warp Compensation

Z-tracking 3D Compensation

The KY8030-2’s moiré technology enables realtime measurement and compensation of board warp, solving the PCB Warp issues with respect to the ideal plane that impact inspection accuracy and reliability.

Automated Solder Paste Dispensing: Auto-Repair (optional)

KY8030-2 adds automated solder paste dispensing as an optional add-on. The high-precision, userfriendly dispensing system helps to eliminate costly mistakes due in large part to insufficient solder in open joints, lean fillets, and weak joints. The KY8030-2’s automatic dispensing option repairs such issues before pass through, resulting in enhanced first pass yield and reduced operational costs.

KSMART: Cutting-Edge Process Optimization Tools for Smart Factory Realization

Koh Young Process Optimizer (optional)

The KSMART Process Optimizer assists with real-time communication of monitoring data from the screen printing processes including insufficient paste, excessive paste, shape deformity based on 3D volume and shape measurements, as well as instances of no paste, bridging, and placement errors.

Real-time alerts prevent print quality problems and monitor printer hardware engagement and print ready status via Pre-DOE, while automatically optimizing printer parameters. It provides real-time alarms based on printing quality during DOE through PDM Lite and verification of printing

results following application of recommended parameters resulting in significant print quality improvements and increased yield.

SPC @KSMART (optional)

Reliable 3D Data based Statistical Process Control

The KY8030-2 also comes with a reliable 3D-Data based Statistical Process Control which lets manufacturers evaluate data using an intuitive graphic interface. It also helps increase the speed of root-cause analysis to provide users with enhanced equipment uptime.

SPC Dashboard Inspection Analysis

Link @KSMART (optional)

3D data based SPI-AOI communication solution

  • Review, diagnosis and optimization of printing, pick-and-place and reflow process
  • Traces root cause of defects by storing and communicating inspection results from Koh Young’s 3D SPI and 3D AOI System

Real-Time Warp Compensation

Z-tracking 3D Compensation

The KY8030-3’s moiré technology enables realtime measurement and compensation of board warp, solving the PCB Warp issues with respect to the ideal plane that impact inspection accuracy and

Pad Referencing 2D Compensation

The high-quality IR light provides for automatic for fast and easy reference teaching even without the CAD file. Moreover, the KY8030-3 allows manufacturers to match non-inspection objects (patterns and fiducial marks) on ideal PCB stencil designs with the ideal PCB pad ocations defined by the CAD file in real time with minimum hassle.

Automated Solder Paste Dispensing: Auto-Repair (optional)

KY8030-2 adds automated solder paste dispensing as an optional add-on. The high-precision, userfriendly dispensing system helps to eliminate costly mistakes due in large part to insufficient solder in open joints, lean fillets, and weak joints. The KY8030-2’s automatic dispensing option repairs such issues before pass through, resulting in enhanced first pass yield and reduced operational costs.

KSMART: Cutting-Edge Process Optimization Tools for Smart Factory Realization

Koh Young Process Optimizer (optional)

The KSMART Process Optimizer assists with real-time communication of monitoring data from the screen printing processes including insufficient paste, excessive paste, shape deformity based on 3D volume and shape measurements, as well as instances of no paste, bridging, and placement errors.

Real-time alerts prevent print quality problems and monitor printer hardware engagement and print ready status via Pre-DOE, while automatically optimizing printer parameters. It provides real-time alarms based on printing quality during DOE through PDM Lite and verification of printing

results following application of recommended parameters resulting in significant print quality improvements and increased yield.

SPC @KSMART (optional)

Reliable 3D Data based Statistical Process Control

The KY8030-2 also comes with a reliable 3D-Data based Statistical Process Control which lets manufacturers evaluate data using an intuitive graphic interface. It also helps increase the speed of root-cause analysis to provide users with enhanced equipment uptime.

SPC Dashboard Inspection Analysis

Link @KSMART (optional)

3D data based SPI-AOI communication solution

  • Review, diagnosis and optimization of printing, pick-and-place and reflow process
  • Traces root cause of defects by storing and communicating inspection results from Koh Young’s 3D SPI and 3D AOI System

Library Manager @ KSMART

Job Management

aSPIre 3 stores and distributes job files and inspection conditions from its centralized DB to multiple SPIs ensuring easy management of modifications and changes following process optimization.

User Level Management

aSPIre 3 has the ability to set up user level groups with various authorities ensuring that the work history of each user is monitored through the user’s data logs.

Link @KSMART (optional)

3D data based SPI-AOI communication solution

  • Review, diagnosis and optimization of printing, pick-and-place and reflow process
  • Traces root cause of defects by storing and communicating inspection results from Koh Young’s 3D SPI and 3D AOI System

Auto-Verification (optional)

Uphold Optimal Machine Conditions

aSPIre 3 offers periodical checks on critical items such as 3D/2D light intensity, PZT Feed, Height Accuracy, and XY Offset. It helps operators to take precautionary measures so that SPI can maintain optimal conditions.

Improve Operational Efficiency

aSPIre 3 also minimizes maintenance through auto-verification of machine conditions during operation to reduce process interruptions and enhance equipment uptime.

Real Time Monitoring (optional)

Process Optimization

aSPIre 3 provides analysis of real-time multi-line management data, enabling the comparison of each machine and line, while allowing for management of machine status for all production lines from remote locations.

Multi-line Production Info

aSPIre 3 provides a detailed history chart, height, volume, and offset for designated lines by ensuring the best products that yield the available machine ranking. It shows machine stats, model information, yield, and alarm time.

Perfecting Inspection Performance with True 3D

Measurement & Inspection of an Array of Defects

Zenith has the ability to make a clear and concise ‘go-or-no-go’ decision for a solder joint inspection, detecting an array of potential defects including Missing solder, Offset, Rotation, Polarity, Upside down, OCV/OCR, Solder filet, Billboarding, Lifted Lead, Lifted Body, Tombstone, Bridging and more.

Template Management for Fast and Intuitive Programming

Zenith’s intuitive interface makes setup easy, reducing programming time in package registration and setting of inspection conditions. The evaluation benchmark can then be easily managed by an operator, simplifying and speeding up programming, while also making identification universal.

KSMART: Cutting-Edge Process Optimization Tools for Smart Factory Realization

Increases equipment uptime by helping operators perform critical process analyses and optimize default settings from an intuitive graphical interface.

The Library Manager stores inspection conditions and real-time job files in a centralized database and distributes the data to multiple machines.

The Offline Program Optimizer makes program creation, debugging and updates seamless. Allowing operators to automatically deploy modified inspection conditions and fine tune processes starting from the next PCB without altering the production schedule.

Links all inspection results, merging images, trends, charts and inspection results including detailed analysis from the SPI, pre-reflow AOI and post-reflow AOI for total line communication and process analysis.

KSMART: Cutting-Edge Process Optimization Tools for Smart Factory Realization

Increases equipment uptime by helping operators perform critical process analyses and optimize default settings from an intuitive graphical interface.

The Library Manager stores inspection conditions and real-time job files in a centralized database and distributes the data to multiple machines.

The Offline Program Optimizer makes program creation, debugging and updates seamless. Allowing operators to automatically deploy modified inspection conditions and fine tune processes starting from the next PCB without altering the production schedule.

Links all inspection results, merging images, trends, charts and inspection results including detailed analysis from the SPI, pre-reflow AOI and post-reflow AOI for total line communication and process analysis.

OPO (Offline Program Optimizer) @KSMART (optional)

Job Fine-tuning with Minimum Downtime

The Offline Program Optimizer makes program creation, debugging and updates seamless, allowing operators to automatically deploy modified inspection conditions and fine tune processes starting from the next PCB without stopping the production line or altering the production schedule.

Link @KSMART

3D data based SPI-AOI communication solution

  • Review, diagnosis and optimization of printing, pick-and-place and reflow process
  • Traces root cause of defects by storing and communicating inspection results from Koh Young’s 3D SPI and 3D AOI Systems

AI-Driven Auto Programming for Rapid Job Programming

The optimized, user-friendly graphic interface is simple to use with flexible, custom configurations as well as AI-driven measuring of selected components that proposes recommended inspection conditions from KY Templates built by AOI experts. This allows for simple, seamless and super-fast auto programming that guarantees true-to-life 3D inspection, yielding a 70% reduction in programming time.


Side-View Camera Solutions for Expanded Inspection Capabilities

KY’s side-view camera solution allows Zenith2 to quickly detect and analyze defects on a wide range of mounted components and chips

Enhanced Auto-Verification Capabilities for Low TCoO

Self diagnosis of lighting and calibration ensures an optimal environment & lower TCoO.

KSMART: Cutting-Edge Process Optimization Tools for Smart Factory Realization

Increases equipment uptime by helping operators perform critical process analyses and optimize default settings from an intuitive graphical interface.

The Library Manager stores inspection conditions and real-time job files in a centralized database and distributes the data to multiple machines.

The Offline Program Optimizer makes program creation, debugging and updates seamless. Allowing operators to automatically deploy modified inspection conditions and fine tune processes starting from the next PCB without altering the production schedule.

Links all inspection results, merging images, trends, charts and inspection results including detailed analysis from the SPI, pre-reflow AOI and post-reflow AOI for total line communication and process analysis.

SPC @KSMART (optional)

Reliable 3D Data based Statistical Process Control

The KY8030-2 also comes with a reliable 3D-Data based Statistical Process Control which lets manufacturers evaluate data using an intuitive graphic interface. It also helps increase the speed of root-cause analysis to provide users with enhanced equipment uptime.

SPC Dashboard Inspection Analysis

Link @KSMART (optional)

3D data based SPI-AOI communication solution

  • Review, diagnosis and optimization of printing, pick-and-place and reflow process
  • Traces root cause of defects by storing and communicating inspection results from Koh Young’s 3D SPI and 3D AOI Systems

Automatic Inspection Solutions for CNC / Assembly Process

True 3D Measurement for CNC and Assembly Process

Patented moiré projection technology enables true 3D measurement on CNC / Assembly Process

Micro 3D measurement capability based on Koh Young’s unrivalled accuracry

Monitoring CNC / Assembly Process

Unique measurement inspection for CNC / Assembly Process

Reliable Surface Defect Identification

– Height Repeatability : 20um at 3 sigma on KY calibration taget

– Length Repeatability : 20um at 3 sigma on KY calibration target

– Metrology Capability : Area, Height, Diameter, Volume

– Types of Defects : Scratch, Flaw, Stain, Burr, Missing, Color, Coplanarity and more

Provide Figure & Exterior 3D inspection simutaneously for maximize productivity

Less than 10 min. programming for a complete inspection file with No fine tunning needed

Neptune T

  • Measurement of transparent and semi-transparent material thickness
  • Side view of non-transparent material profile
  • Classification of the real signals from the raw images

Neptune T

  • Measurement of conformal coating thickness of various places
  • Coatings on PCB board, solder joint, lead top and THT application.

Neptune T

  • Measurement of diameter and height of the lens
  • Capable to identify the lens profile

Neptune T

  • Identify the scratches on the filling in the pressure sensor
  • Capable to identify and measure the coating around the chip in the pressure sensor
  • Measurement of the height of the
    filling and the chip.

Neptune T

  • Measurement of the height and width of the underfill
  • Capable to reconstruct the profile of the underfill in 3D with several structures

Tower(Rack)

Individual belt operations type

PCB 20 slots (±15mm)

Tower(Rack)+NG Conveyor

Individual belt operations type

Visual identification of NG PCB

PCB 20 slots (±15mm)

Identifier and RS-232C communications module allow easy identification of NG points (optional)

Magazine Buffer

Accommodates single-size racks

Mode : Loader / Unloader

NG stacking / Buffering

By pass

Combi - Magazine

Individual belt operations type

Fast cycle

Buffering + NG stacking

Accepts one magazine rack

PCB 20 slots (±15mm)

Destacker-Knife

Separates PCB sheets with a blade

Maximum PCB load of 30 kg

Destacker-Clamp

Separates PCB sheets with clamping

Maximum PCB load of 50 kg

Vacuum Loader - Edge

Fixed vacuum pad

Maximum PCB load of 50 kg

Valve manual lock

Push-up Stacker

Suitable for off-line laser line

Magazine Unloader

Accommodates single-size racks

Magazine Unloader-All type

Accommodates multiple rack sizes

Magazine Unloader - Single

Accommodates multiple rack sizes

Accommodates single rack

Designed for limited spaces

Shuttle Unloader

Accommodates multiple rack sizes

Accommodates two magazine racks

Single shuttle integral type

Designed for limited spaces

Magazine Loader

Accommodates single-size racks

Magazine Loader-All type

Accommodates multiple rack sizes

Magazine Loader - Single

Accommodates multiple rack sizes

Accommodates single rack

Designed for limited spaces

Shuttle Loader

Accommodates multiple rack sizes

Accommodates two magazine racks

Single shuttle integral type

Designed for limited spaces

Contact Us

In case of any questions, please write us on the e-mail address below, or fill in the form on the right, and send us a message!

Our Headquarters

Visit us in our office, and ask your questions. Our colleagues are ready to help you in any kind of aspect.

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